multilayer chip inductor revision february 12, 2014 1 / 5 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scml series socay electronics co., ltd. www.socay.com u multilayer monolithic construction yields high reliability u excellent solderability and heat resistance for either wave or reflow soldering. u rf and wireless communication u information technology equipment which includes computer u telecommunications u radar detectors u automotive etc. operating temperature range -40 ~ +85 o c storage condition less than 40 o c and 70% rh storage time 12 months max. soldering method reflow or wave soldering 1 series name 2 size code: the first two digitals: length(mm), the last two digitals : width(mm) 3 inductance (r=decimal point) unit: h 4 tolerance: m = 20% 5 packaging: t - embossed plastic tape, 7" reel. 6 soldering : green parts, f - lead-free for whole chip general technical data part numbering scml 2520 4r7 m t f ( 1 ) ( 2 ) ( 3 ) ( 4 ) ( 5 ) ( 6 ) f eatures app lications
multilayer chip inductor revision february 12, 2014 2 / 5 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scml series socay electronics co., ltd. www.socay.com part number inductance 10% ( h) test freq. (mhz) s.r.f (mhz) min dcr ( ) max rated current (ma) 2012 series scml2012 2r2mtf 2.2 1 70 0.17 900 scml2012 4r7mtf 4.7 1 40 0.23 700 2016 series scml2016 2r2mtf 2.2 1 40 0.12 1100 scml2016 4r7mtf 4.7 1 20 0.16 900 2520 series scml2520 1r0mtf 1.0 1 60 0.055 1600 scml2520 1r5mtf 1.5 1 50 0.070 1500 scml2520 2r2mtf 2.2 1 40 0.080 1300 scml2520 3r3mtf 3.3 1 30 0.100 1200 scml2520 4r7mtf 4.7 1 25 0.110 1100 test level 100 mv test instruments u hp4291b rf impedance / material analyzer @1mhz u hp4338a/b milliohmmeter * for special part number which is not shown in above table, please refer to the appendix. electrical characteristics (continue)
multilayer chip inductor revision february 12, 2014 3 / 5 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scml series socay electronics co., ltd. www.socay.com 20 for lead free solder dimension 2012 (eia 0805) 2016 (eia 0806) 2520 (eia 1008) l 2.00 0.20 2.00 0.20 2.50 0.20 w 1.25 0.20 1.60 0.20 2.00 0.20 t 0.90 0.10 0.90 0.10 0.90 0.10 e 0.50 0.30 0.50 0.30 0.50 0.30 unit: mm size a b c 2012 1.0~1.2 3.0~4.0 0.8~1.1 2016 1.0~1.2 3.0~4.0 1.0~1.5 2520 1.2~1.5 3.5~4.0 1.5~2.0 unit: mm construction & dimensions recommended soldering conditions recommended pad layout l t e e w 25 150 200 217 260 pre-heating soldering 60~120 second 30 second 60~150 second time (sec.) temperature ( o c )
multilayer chip inductor revision february 12, 2014 4 / 5 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scml series socay electronics co., ltd. www.socay.com unit: mm 2012 2016 2520 symbol e e e w 8.00 0.10 8.00 0.10 8.00 0.10 p 4.00 0.10 4.00 0.10 4.00 0.10 e 1.75 0.10 1.75 0.10 1.75 0.10 f 3.50 0.05 3.50 0.10 3.50 0.05 d 1.55 0.05 1.55 0.05 1.55 0.05 d1 1.00 0.05 1.00 0.05 1.00 0.05 p 4.00 0.10 4.00 0.10 4.00 0.10 p 0 10 40.00 0.20 40.00 0.20 40.00 0.20 p2 2.00 0.10 2.00 0.10 2.00 0.10 a0 1.40 0.10 1.80 0.10 2.25 0.10 b0 2.30 0.10 2.20 0.10 2.80 0.10 k0(t) 1.35 0.10 1.15 0.10 1.35 0.10 t 0.22 0.05 0.22 0.05 0.22 0.05 part size (eia size) packaging option quantity 2012 (0805) 7 reel 3,000 2016 (0806) 7 reel 3,000 2520 (1008) 7 reel 3,000 unit: mm the contents of a box 2012 (0805): 6 reels / inner box 2016 (0806): 6 reels / inner box 2520 (1008): 6 reels / inner box tape and reel specifications plastic carrier direct ion of feed reel specifications & packaging
multilayer chip inductor revision february 12, 2014 5 / 5 @ socay electronics co., ltd. 2014 specifications are subject to change without notice. please refer to www.socay.com for current information. scml series socay electronics co., ltd. www.socay.com test item test condition criteria resistance to solder heat 1. solder temperature : 260 5 o c 2. flux : rosin 3. dip time : 10 1 sec 1. more than 95 % of terminal electrode should be covered with new solder 2. no mechanical damage 3. induction value should be within 10 % of the initial value adhesive test 1. reflow temperature : 245 o c it shall be soldered on the substrate applying direction parallel to the substrate 2. apply force(f) : 5 n 3. test time : 10 sec 1. no mechanical damage 2. soldering the products on pcb after the pulling test force > 5 n steam aging test 1. temperature : 93 o c 2. test time : 8 hours 3. solder temperature : 235 5 o c 4. flux : rosin 5. dip time : 5 1 sec 1. more than 95 % of terminal electrode should be covered with new solder temperature cycle 1. temperature : -40 ~ +85 o c for 30 minutes each 2. cycle : 100 cycles 3. measurement : at ambient temperature 24 hours after test completion 1. no mechanical damage 2. induction value should be within 20 % of the initial value operational life 1. temperature : 85 o c 5 o c 2. test time : 1000 hours 3. apply current : full rated current 4. measurement : at ambient temperature 24 hours after test completion 1. no mechanical damage 2. induction value should be within 10 % of the initial value biased humidity 1. temperature : 40 o c 2 o c 2. humidity : 90 ~ 95 % rh 3. apply current : full rated current 4. test time : 1000 hours 5. measurement : at ambient temperature 24 hours after test completion 1. no mechanical damage 2. induction value should be within 20 % of the initial value rated current at ambient temperature & humidity test time: 5 minutes (under full rated current) mip product surface temp: below room temperature plus 40 o c reliability and test condition
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